The PLS6MW Multi-Wavelength Laser Platform uses multiple laser wavelengths to process the broadest possible spectrum of materials. The PLS6MW is built on Universal’s patented Rapid Reconfiguration technology, so changing laser wavelength is as easy as changing the laser source and requires no tools, optics changes or software reconfiguration. This cost-effective, small-footprint, total material processing solution is ideal for fast-paced R&D and production environments and is only available from Universal Laser Systems.
1.06 micron – Fiber
Materials: Most metals, some plastics. When configured with a 1.06 micron pre-aligned interchangeable fiber laser, the PLS6MW can mark most metals and some plastics.
10.6 micron – CO2
Materials: Plastics, textiles, wood and some metals. Reconfigure the PLS6MW with a standard 10.6 micron pre-aligned interchangeable CO2 laser to open up the full breadth of organic material processing capabilities.
9.3 micron – CO2
Materials: Some plastics. Reconfigure the PLS6MW with a specialized 9.3 micron pre-aligned interchangeable CO2 laser for excellent results on certain highly-functional plastics.
Materials: Some complex materials, including mirrored acrylic, adhesive-backed foils and some plastics. The multi-wavelength functionality of the PLS6MW can be used to accomplish some tasks which are impossible if only a single laser source is used.
Uniquely Universal Features
Universal Laser Systems has developed the world’s most advanced,
powerful and flexible laser print driver.
1-Touch Laser Photo™
We developed this software to make any photographic image suitable for
Universal Laser Cartridges
Our exclusive line of patented CO2 Free-Space Gas Slab Lasers is designed
specifically for the needs of laser cutting, engraving, graphic imaging and
High Power Density Focusing Optics™
These optics allow the laser beam to be focused to a much smaller spot,
producing sharper images at tighter tolerances.
Rapid Reconfiguration™ of Lasers
Every laser cartridge we produce is factory pre-aligned for easy integration
into any of our laser platforms.
Dual Laser Configuration
Giving you the ability to merge two independent laser sources into a
single beam for additional power and flexibility.
|Work Surface Area||32 x 18 in (813 x 457mm)|
|Maximum Part Size||37 x 23 x 9 in (940 x 584 x 229mm)|
|Dimensions||44 x 39 x 36 in (1118 x 991 x 914 mm)|
|Rotary Capacity||Max Diameter 8 in (203 mm)|
|Motorized Z-axis Lifting Capacity||40 lbs (18 kg)|
|Available Focus Lenses||2.0" MW (51 mm)
recommended for most 10.6 and 9.3 micron applications
4.0" MW (102 mm) *standard
recommended for most 1.06 micron applications
|Laser Platform Interface Panel||Keypad and LCD display shows current file name, laser power, engraving speed, PPI and run time.|
|Operating System Compatibility||Requires a dedicated PC to operate.
Compatible with Windows XP/Vista/7 32/64 bit
|PC Connection||USB 2.0|
|Optics Protection||Air Assist Optional|
|1.06 µm (Fiber)||30 and 40 Watts|
|10.6 µm (CO2)||10, 25, 30, 40, 50, 60 and 75 Watts|
|9.3 µm (CO2)||30 and 50 Watts|
|Approximate Weight||345 lbs (156 kg)|
|Exhaust Connection||Two 4 in (102 mm) ports
500 CFM @ 6 in static pressure (850 m3/hr at 1.5 kPa)